austriamicrosystems AG is a leading designer and manufacturer of highly integrated analog and analog intensive mixed signal ICs.
Chartered Semiconductor Manufacturing, one of the world’s top three silicon foundries, is forging a customized approach to outsourced semiconductor manufacturing
GSMC Grace Semiconductor Manufacturing Corporation http://www.gsmcthw.com
Grace Semiconductor Manufacturing Corporation (Grace) is a pure IC foundry company that specializes in Integrated Circuit (IC) fabrication.
IHP Microelectronics http://www.ihp-microelectronics.com/
Jazz Semiconductor http://jazzsemi.com/
Peregrine Semiconductor http://www.psemi.com/
Polar Semiconductor, Inc. (PSI). http://www.polarfab.com/
PolarFab has optimized its technology to deliver high-performance analog and analog-rich mixed-signal circuits.
SMIC Semiconductor Manufacturing International Corp http://www.smics.com
Tower Semiconductor www.towersemi.com
Tower Semiconductor Ltd. is an independent wafer manufacturer strategically focused on advanced Flash memory and CMOS image-sensor technologies.
TSMC Taiwan Semiconductor Manufacturing Company Limited http://www.tsmc.com/
TSMC is a trusted source to both the smallest fabless start-up ventures and to multi-national, multi-product companies.
UMC offers one of the widest portfolios of advanced technologies available, including numerous enhanced performance processes and copper-interconnect technology.
X-FAB Silicon Foundries is the leading analog/mixed-signal foundry manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs).
Typical submicron cmos model files can be downloaded from mosis.org
cmos Model files from mosis.org, new technologies
cmos Model files from mosis.org, old technologies
silicon wafer manufactureers
Addison Engineering, Inc. – Vendor of silicon wafers, ceramic packages, and semiconductor materials.
Advanced Interconnect Technology – Provides custom wafer bumping and flip-chip bonding service to the semiconductor wafer fabrication and chip packaging houses.
American Precision Dicing, Inc. – Wafer dicing of hard brittle materials for the semiconductor industry.
American Xtal Technology – Manufactures and sells compound semiconductor substrates, including gallium arsenide, indium phosphide and germanium substrates. (Nasdaq: AXTI)
Amkor Technology, Inc. – Supplier of outsourced semiconductor interconnect and CMOS wafer foundry services.
Amtech Systems, Inc. – Manufactures and markets wafer processing and handling equipment for semiconductor manufacturers. (Nasdaq: ASYS)
Applied Materials, Inc. – The world’s largest supplier of products and services to the global semiconductor industry, and one of the leading information infrastructure providers.
Applied Science and Technology, Inc. – Designs, manufactures and markets proprietary systems and components used to produce materials such as semiconductors and diamonds utilizing microwave plasma techniques. (Nasdaq: ASTX)
Asq Technology – Manufactures quartz boats, silicon carbide boats, wafer transfer machines, boat lift handles, custom quartz products.
Benchmark Technologies – Provides reticles (photomasks) to the MEMS, photonics (waveguides), and semiconductor industries.
Cabot Microelectronics Corporation – Supplies slurries for polishing various materials used in semiconductor manufacturing processes. (Nasdaq: CCMP)
Compart Technology – Supplier of all types of silicon wafers.
DuPont Photomasks – Photomasks and reticles for semiconductor, LCD and other microelectronics manufacturing.
EMCORE Corporation – Designs and develops compound semiconductor materials, such as gallium arsenide, and process technology. (Nasdaq: EMKR).
Encompass Distribution Services LLC – Supplier of silicon products to the OEM, material service companies, and research labs that support the semiconductor business.
Epiwafer – Supplying prime wafers, epitaxial wafers, SOI wafers, compound semiconductor wafers and offering the technical services for epitaxial systems setup and refurbishment. From Korea.
Global Chip Materials – Stocking distributor of ceramic packaging materials for microelectronic IC assembly. Online catalog of packaging materials with dimensions and drawings.
GPM, Inc. – Specializing in the fabrication and repair of silicon wafer dicing chucks for the semiconductor industry.
III/V-Reclaim – Reclaim (recycles) GaAs and InP 1″ to 150mm wafers, removing all layers and structures. Offers single and double side polishing. Based in Germany.
Inostek inc. – Manufacturer of PZT Sol-Gel solutions and platinum thin films for FeRAM, DRAM, IR sensors, and MEMS.
Isonics Corporation – Offers isotopically pure silicon-28 to replace natural silicon in the production of wafers for computer chips. (Nasdaq: ISON).
Kumkang Quartz Co., Ltd – Manufacturer of quartz ware – tubes, boats and other quartz wares for semiconductor processing.
MEMC Electronic Materials, Inc. – Silicon wafer manufacturing.
MINCO Technology Labs Inc. – A semiconductor processor, assembler and tester serving the medical, military, space and commercial industries.
Montco Silicon Technologies, Inc. – Silicon wafer sales and services, supplying all sizes from 2″ to 300mm.
Nitto Denko – Semiconductor encapsulating materials, polarizing and retardation films for LCDs, flexible printed circuit boards.
North East Silicon Technologies, Inc. – Provides silicon wafer reclaim and silicon test wafer sales of 3 inch to 300mm diameter wafers.
Polishing Corporation of America – Polishing of silicon wafers from 1″ to 12″ including oxides, metals, wafer reclaim and stripping, slicing, lapping, polishing.
Process Specialties – Provider of semiconductor wafer processing, specializing in 100mm – 300mm wafers.
Promerus, LLC – Provides material solutions for applications in the semiconductor, optoelectronic and electronic packaging markets.
Pure Wafer Ltd – A provider of silicon wafer reclaim and finishing services.
Rodel Inc. – Offers a fully-integrated solutions for chemical mechanical planarization (CMP) and surface preparation needs for semiconductor devices, silicon and other substrate wafers, computer memory disks, and precision optics.
RSA Le Rubis SA – Manufacturer of sapphire monocrystals, blanks and polished parts with information on products, processes, company profile and contacts.
SawTech Corporation – Provide high precision dicing and scribing services.
Semi Metals LLC – A provider silicon wafers.
Semiconductor Assembler and Manufacturer Sdn. Bhd. – Semiconductor, transformer and RF packaging provider in Malaysia.
Semiconductor Products Manufacturing, Inc. – Manufacturer of consumable components for semiconductor fabrication and test.
Silicon Inc. – Provider of silicon wafer material, from 1 inch to 12 inch, for semiconductor fabs.
Silicon Valley Microelectronics, Inc. – Provider of silicon wafers and wafer services.
Thermocarbon, Inc. – Dicing blades, saws, accessories and precision cutting services.
Ultrasil Corporation – Manufacturers silicon products with ultraflat surfaces with very low metals results for any diameter in single side and double side polished wafers from 3″ to 200mm.
Virginia Semiconductor – Silicon wafers, silicon substrates and components delivered in 3-10 business days.
Windrush – Supply specialist wafer and small-parts handling equipment from hand tools to machines.
Analog IC and layout Design Software
Some contract manufacturing companies
ACI Group – Offers turnkey contract manufacturing, logistics and testing services.
Advanced Thin Film Technologies – Supplying custom coatings and patterned substrates to customers involved with microelectronics with information on coatings, patterning, capabilities, manufacturing and contacts.
Advanced Thin Film Technology – Provides high quality thin film coatings, patterned substrates, hybrid and resistor networks.
AME AS – Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.
Amitec – Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.
ASE Korea, Inc. – Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF.
Catalyst Microtech LLC – Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages. List of services and factory equipment and quotation form.
Chartered Semiconductor Manufacturing – Dedicated integrated circuit (IC) wafer foundry
Cirtek Electronics Corporation – An independent subcontractor for semiconductor assembly, test and packaging services.
DALSA Semiconductor – Open foundry offering specialty wafer fabrication for MEMS, high voltage CMOS, analog and mixed signal CMOS, and CCDs with experience in telecom, telephony, and optical networking chips. Company overview, facilities and manufacturing process descriptions.
Dolphin Technology Inc. – Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks.
Eltek Semiconductors Ltd – Procuring and processing semiconductor components in wafer, die and packaged form.
First Level Inc. – Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
Honeywell Electronic Materials – Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Site includes product and technology briefs, and a description of company’s manufacturing cleanroom.
HTE Labs – Provides wafer foundry, R&D support and specialty wafer fab processing to customers from semiconductors and microelectronic industry; active and passive components, and opto devices. Semconix Corporation.
Incide – A fabless design house focused on RF and high-speed digital integrated designs.
Jade Precision Engineering Pte Ltd – Singapore-based company providing lead-frame stamping, milling, plating, and taping services for semiconductors. Company history, description of services, and photos of example products.
NOVASIC – Providing wafering and polishing services of high performance semiconductors and industrial crystals.
PolarFab – Bipolar and BiCMOS wafer manufacturing processes. Bloomington, MN, USA.
Prema Semiconductor – Fabricates analog and mixed-signal ICs
Premier Semiconductor Services – Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.
Prologue Technology Inc. – Manufacturer representative for semiconductor design and manufacturing. Based in Markham, Ontario, Canada, serving primarily Canada, Central and Eastern US. Close proximity to the Lester B. Pearson Airport in Toronto.
Promex Industries Inc. – Microelectronics technologies, specialty chip packaging, design, layout, materials expertise, process engineering for outsourced optoelectronics, microelectronics, chip packaging and manufacturing. From China.
Protochips Inc. – Offers custom layout and fabrication services for emerging companies and university groups.
Reltech Limited – European supplier of advanced semiconductor burn-in and reliability test systems.
Satcon Electronics – Manufacturer standard and custom microelectronic assemblies, thin film substrates, semiconductor packaging and wire bonding. Company overview and list of capabilities.
Sigurd Microelectronics Corporation – Provides semiconductor IC assembly and testing services.
Silicon Infusion Limited – Provides single chip solutions for T1/E1/J1, DTMF, ADPCM, and many other telecommunications standards.
Silterra Malaysia Sdn Bhd – Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia.
1st Silicon – Semiconductor foundry founded in 1998 by the Malaysian State of Sarawak. 0.18 and 0.25 micron CMOS and mixed signal CMOS IC.
Tower Semiconductor LTD. – Independent foundry of semiconductor integrated circuits specializing in embedded nonvolatile memory, CMOS image sensors, and mixed signal devices. 0.35 micron and up. Israel.
Trikon Technologies – Semiconductor manufacturer utilizing plasma etch, PVD (physical vapour deposition) and CVD (chemical vapour deposition) equipment.
Valtronic – Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Site include capabilites, and illustrated discussions of packaging technologies and processes.
ViASIC – Company offering low NRE one mask architecture and software solutions to the ASIC community. Aimed at FPGA conversion and ASIC replacement markets.
WaferTech – Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.
Walls Technology Co. – Custom RF and microwave (wireless) product development. Requirements definition, analysis, design, prototype build and test.