rfcmos power amplifier design challenges

Wireless applications are witnessing tremendous growth with proliferation
of different standards covering wide, local and personal area networks (WAN,
LAN and PAN). The trends call for designs that allow 1) smooth migration to
future generations of wireless standards with higher data rates for multimedia
applications, 2) convergence of wireless services allowing access to different
standards from the same wireless device.

The key to integration, and reduction in costs is the correct choice of the implementation

technology. CMOS technology has played an important role in
providing higher functionality and complexity at low costs.The performance of
power amplifiers is a crucial issue for the overall performance of the transceiver’s
chain. Until now, power amplifiers for wireless applications have been produced
almost exclusively in GaAS technologies, with few exceptions in LDMOS,
Si BJT, and SiGe HBT. Sub-micron CMOS processes are now considered
for power amplifier design due to the higher yield, and the lower costs it
can provide. A typical power amplifier module for wireless communications
consists of 3 dies, and 15-20 passive components plus decoupling. A CMOS
power amplifier design solution could lead to component count that can be
reduced to one die and 3-5 passives plus decoupling. This reduction in component
count leads to a significant reduction in power amplifier cost.
The is the first monograph addressing RF CMOS power amplifier design
for emerging wireless standards.The focus will be on power amplifiers for
short distance wireless personal and local area networks (PAN and LAN), however
the design techniques are also applicable to emerging wide area networks
(WAN) infrastructures using micro or pico cell networks. The book discusses
CMOS power amplifier theory and design principles, describes the architectures
and tradeoffs in designing linear and nonlinear power amplifiers. It then
details design examples of RF CMOS power amplifiers for short distance wireless
applications (e.g,Bluetooth, WLAN) including designs for multi-standard
platforms. Design aspects of RF circuits in deep submicron CMOS are also